Low dark signal
Capacitive Transimpedance Amplifier (CTIA) pixel design
Dual gain/full well pixel design selectable on a row-by-row basis
Global snapshots integrate while read (IWR) operation
Radiation tolerant design
Standard packaging includes the FPA packaged in a connectorized rugged packaging and the associated interface cable(s)
Options are available for packaging in a complete Integrated Dewar Assembly (IDA) upon request
Non-rectangular packaging for scanning applications is available via our CHROMA-D series packaging
